| abstract |
The purpose of the present invention is to improve storage stability of a resin composition used for applications such as semiconductor sealing materials. Provided is a resin composition, comprising: (A) an epoxy resin; (B) a curing agent; and (C) a silica filler, wherein the silica filler as the component (C) is surface-treated with a basic substance having an acid dissociation constant (pKa) of a conjugate acid of 9.4 or higher. The resin composition further comprises a silane coupling agent (D), or the silica filler as the component (C) is further surface-treated with a silane coupling agent. |