| abstract |
PROBLEM TO BE SOLVED: To provide a wire bondability and a beam lead bondability after bonding a semiconductor chip and a chip mounting portion, and to adhere to at least one surface of a silicone adhesive sheet as required. Provided are a silicone-based adhesive sheet having good releasability from a releasable film, and a semiconductor device having excellent reliability. SOLUTION: This is a silicone-based adhesive sheet for bonding a semiconductor chip to a chip mounting portion, comprising a crosslinked sheet of a crosslinkable silicone composition, wherein particles having a thickness of not more than the thickness of the sheet. A silicone-based adhesive sheet having a diameter and a spherical filler having an average particle diameter of 50 to 100% with respect to the film thickness; And a semiconductor device comprising a semiconductor chip bonded to the chip mounting portion with the silicone adhesive sheet. |