| abstract |
Disclosed is a die attachment adhesive that enables creation of a space having a predetermined gap between a chip and a chip support. The die attach adhesive, together with the curable polymer substrate, is sufficient to provide a flat adhesive layer thickness between the substrates joined by the adhesive contained in the polymer substrate. An inorganic insulator particle having an average particle size of 1 μm to 1000 μm and an aspect ratio of a major axis to a minor axis of about 1.0 to 1.5, and the curable polymer group, 240 μm / m before and after an arbitrary glass transition temperature between −55 ° C. and + 200 ° C. when it is determined at a rate of temperature increase of 5 ° C./min, at least 50% by mass based on the amount of material. Said low thermal expansion having a size in the range of 10 μm to 100 μm, comprising at least one low thermal expansion coefficient filler present in an amount sufficient to obtain an adhesive having any linear thermal expansion coefficient less than / ° C. Coefficient filler is present in an amount of less than 0.1% by weight It is a curable adhesive composition characterized by the above. [Selection] Figure 1 |