| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2483-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2479-086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-412
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-1242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-06 |
| filingDate |
2012-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81d5f788bb1f23bdbaeb74c8d074649a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d0d78451b823acf2a8bdd86538acdca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3253ce6a87d9043c1ad5f98c66951607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fbf458bd4553d5cce4ca36fa11d34b9 |
| publicationDate |
2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2639277-A1 |
| titleOfInvention |
Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tape |
| abstract |
The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame. n In a preferred embodiment the pressure-sensitive adhesive layer at a side on which a semiconductor chip is not to be encapsulated with a resin comprises a heat-expandable pressure-sensitive adhesive containing heat-expandable micro spheres. n In another preferred embodiment the ratio of a silicone rubber to a silicone resin in the silicone pressure-sensitive adhesive is from 95/5 to 20/80. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3780072-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019505611-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104559817-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104559817-A |
| priorityDate |
2012-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |