abstract |
The present invention provides a kind of sheet for processing semiconductor material.Sheet for processing semiconductor material (1) of the invention has substrate (2) and lamination in the adhering agent layer (3) at least one face of the substrate, wherein, adhering agent layer (3) is formed by adhesion agent composition, and the adhesion agent composition contains: the polymer with salt and energy ray-curable group and the energy ray-curable adhesion ingredient in addition to above-mentioned polymer.The sheet for processing semiconductor material (1) can play sufficient antistatic property, and inhibit the pollution of adherend when removing after energy line irradiation. |