| abstract |
A semiconductor chip carrying adhesive tape,nwherein a plurality of adhesive agent portions fornadhering semiconductor chips 2 are intermittentlynformed on a tape shaped base material 11 in thenlongitudinal direction of the base material 11 to havena substantially identical shape with that of thensemiconductor chip 2 to be adhered or a slightlynlarger shape than that, and an adhesive agentnconstituting said adhesive agent portions 12 hasngradable adhesiveness, can improve a yield of adhesivenagent attached semiconductor chips 2 and prevent anwasteful use of an adhesive agent. |