| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
2021-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d19d52651943f66bee8286c2d06f894
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ed30811a2da265690a837f6d6cdfaba |
| publicationDate |
2021-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210097028-A |
| titleOfInvention |
Masking material |
| abstract |
[Problem] To provide a masking material that is difficult to generate chips when subjected to a dicing process, and which is difficult to peel off during dicing and which can be easily peeled off after dicing. [Solution Means] The masking material of the present invention includes a pressure-sensitive adhesive layer formed of an active energy ray-curable pressure-sensitive adhesive and a base material. The base polymer of this active energy ray-curable adhesive is obtained by polymerizing a monomer composition comprising 5 mol% to 20 mol% of a (meth)acrylic monomer having at least one alkyl group selected from the group consisting of a methyl group and an ethyl group. It is a polymer. This masking material is affixed to a silicon wafer, and an active energy ray is irradiated, and the surface roughness Sa of the dicing cut surface of the adhesive layer after dicing the masking material and the silicon wafer in the state which hardened the adhesive layer is 3 micrometers or less. |
| priorityDate |
2020-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |