patent/WO-2008149625-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008149625-A1

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filingDate	2008-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9660bae9baf6dc48961c9dd1c4138de6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6114594578ef315e984fbdf9510ed33a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9193f418a93e6e44f6c7c437cba9eafd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5b232564d96e458f570df2500cf61ce
publicationDate	2008-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	WO-2008149625-A1
titleOfInvention	Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device
abstract	Disclosed is a photosensitive adhesive composition containing an alkali-soluble polymer (A), a thermosetting resin (B), one or more radiation polymerizable compounds (C) and a photoinitiator (D). In this photosensitive adhesive composition, the mixture of all the radiation polymerizable compounds has a 5% weight loss temperature of not less than 200˚C.
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priorityDate	2007-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002003715-A
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5770 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID226395003

Total number of triples: 111.