| abstract |
An adhesive tape for protecting the surface of a semiconductor wafer comprises a substrate resin film and an adhesive layer directly on the substrate resin film with an intermediate resin layer, in which base resin components containing an acrylic polymer and/or polyurethane acrylate are cross-linked, interposed therebetween. The repulsion coefficient (γ) obtained by dividing repulsion force (α) per unit width, which is found from the load of loop stiffness obtained by measuring the adhesive tape for protecting the surface of the semiconductor wafer under a specific condition, by the square of the thickness (β) of a substrate is 100 mN/mm 3 or more, the repulsion force (α) is 13 mN/mm or less, and the difference between tensile fracture elongations in a longitudinal direction and a lateral direction is 35% or less. |