| abstract |
The present invention provides an adhesive for an electronic component and an adhesive for an electronic component capable of maintaining a distance between the electronic components with high accuracy and obtaining a highly reliable electronic component such as a semiconductor device when joining two or more electronic components such as semiconductor chips. It aims at providing the manufacturing method of a semiconductor chip laminated body which was used, and a semiconductor device.n n n This invention contains the adhesive composition which has a curable compound and a hardening | curing agent, and the spacer particle whose CV value is 10% or less as an adhesive agent for electronic components for joining an electronic component, and measured the viscosity at 25 degreeC using the E-type viscosity meter. In this case, the viscosity at 1 rpm is 200 Pa · s or less, the viscosity at 10 rpm is 100 Pa · s or less, and the viscosity at 0.5 rpm is 1.4 to 3 times the viscosity at 1 rpm, and at 1 rpm. It is an adhesive for electronic components whose viscosity is 2 to 5 times the viscosity in 10 rpm. |