| abstract |
The present invention relates to an adhesive composition, preferably a pressure-sensitive adhesive composition, comprising: a) at least one (co)polymer comprising at least isobutene and/or butene as comonomer species and optionally but preferably comprising At least one comonomer species having a softening point above 40°C when considered in the form of a hypothetical homopolymer, b) at least one at least partially hydrogenated adhesive resin, c) at least one type based on cyclic ethers A reactive resin having a softening point below 40°C, preferably below 20°C, d) at least one type of latent reactive thermally activatable initiator for initiating cationic curing. |