abstract |
The present invention relates to an FPIC film and a method for manufacturing the same, and not only has excellent developability, but also relates to an FPIC film excellent in hole plugging and bendability and a method for manufacturing the same. In addition, the present invention relates to a method for manufacturing a flexible printed circuit board, and there is no separate PEB (post exposure bake) process for heating and drying the photosensitive material after exposure and before development using the FPIC film of the present invention. It relates to a method for manufacturing a simple and flexible flexible printed circuit board. |