http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
Outgoing Links
| Predicate | Object |
|---|---|
| concordantIPC | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| level | 9^^<http://www.w3.org/2001/XMLSchema#integer> |
| symbol | H05K3/06 |
| modified | 2019-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| title | Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process |
| type | http://data.epo.org/linked-data/def/cpc/SubGroup |
| broader | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-02 |
Incoming Links
Total number of triples: 5269.