| abstract |
Disclosed is a rolled copper foil or electrolytic copper foil for an electronic circuit, which is formed into a circuit by etching. The rolled copper foil or electrolytic copper foil for an electronic circuit is characterized by comprising a layer of one or more metals selected from among platinum group elements, gold and silver that have a lower etching rate than the copper formed on the etching surface side of the rolled copper foil or electrolytic copper foil, or alternatively comprising an alloy layer mainly containing one or more of the above-described metals. By the rolled copper foil or electrolytic copper foil, sagging caused by etching can be prevented and a desired circuit having a uniform circuit width can be formed when the circuit is formed by etching the copper foil of a copper-clad laminate. Moreover, the time necessary for forming a circuit by etching can be reduced as much as possible, the etching performance in pattern etching can be improved, and occurrence of short-circuits or defects in circuit width can be prevented. |