| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F212-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F212-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-38 |
| filingDate |
2019-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_828138769d729db0d51635ec0cdcda1d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0502195b3ce551cb9a304476824d2570
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14a279f01565268df89d7782f63ffeff |
| publicationDate |
2020-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202005995-A |
| titleOfInvention |
Photosensitive resin composition and method for forming resist pattern |
| abstract |
The present invention provides a photosensitive resin composition for heating after exposure and then developing to obtain a cured resin. The above-mentioned photosensitive resin composition contains (A) 10% by mass to 90% by mass of alkali-soluble polymer and (B) 5% by mass to 70% by mass of ethylenically unsaturated double-component based on the mass of its total solid content. The bond compound and (C) 0.01 to 20% by mass of the photopolymerization initiator. The inorganic value (I value) of the alkali soluble polymer (A) is 720 or less; or the solubility parameter (sp value) of the alkali soluble polymer (A) is 21.45 MPa 1/2 or less; or the photosensitive resin combination Based on the mass of the total solid content in the photosensitive resin composition as a reference, it contains 3% by mass or more of alkali-soluble polymer (A-1), and the alkali-soluble polymer (A-1) contains 52% by mass or more of the source Structural units derived from styrene and/or styrene derivatives are used as monomer components. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I793995-B |
| priorityDate |
2018-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |