| abstract |
The manufacturing method of the structure having a conductor circuit according to the present invention includes patterning the first photosensitive resin layer in the first patterning step in accordance with the shape of the opening formed in the thermosetting resin layer. Various openings can be provided. In addition, in the method of manufacturing a structure having a conductor circuit, a plurality of openings can be formed at the same time, unlike the case of forming openings with a laser, and resin residues around the openings can be reduced. For this reason, even when the number of pins of the semiconductor element increases and a large number of fine openings need to be provided, a structure having excellent reliability can be manufactured sufficiently efficiently. |