http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020226125-A1

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filingDate 2020-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adf4e3b8970ed1410e1c5ac35ad30e8e
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publicationDate 2020-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2020226125-A1
titleOfInvention Method for producing printed wiring board, and printed wiring board
abstract This method for manufacturing a printed wiring board comprises: a step for preparing a metal foil-clad laminate in which a metal foil having an arbitrary thickness (Db) in a range of from 3 to 20 μm and an insulating resin layer are laminated; a step for forming a resist layer on a surface of the metal foil; a step for forming a resist pattern by subjecting the resist layer to exposure/development; a step for forming metal wires by etching the metal foil where the resist pattern is not formed by spraying an etching solution; and a step for removing the resist layer. In the step for forming the metal wires, the metal wires are formed such that the metal wires have a gap (S) of 15 to 50 μm, and that a ratio (S/Db) of an arbitrary thickness (Db) of the metal foil and the gap (S) between the metal wires is greater than 1.6.
priorityDate 2019-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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