abstract |
The photosensitive resin composition of the present invention contains (A) an alkali-soluble polymer, (B) a compound having an ethylenic double bond, and (C) a photopolymerization initiator, and (A) the alkali-soluble polymer is as follows Formula (I): {In the formula (I), W i is the mass of each of the comonomers constituting the alkali-soluble polymer, and Tg i is the glass transition when each of the comonomers constituting the alkali-soluble polymer is a homopolymer. Temperature, W total is the total mass of the alkali-soluble polymer, and n is the number of types of comonomers constituting the alkali-soluble polymer} The glass transition temperature (Tg total ) obtained is below 100 ° C, (B) Compounds with ethylenic double bonds -Compounds of triketone structure. |