http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019208461-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 2019-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6cedfab4efe83dc82970e69708359f7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a250734739aa6fb681367c1bd798dc50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_060f32fc4d0497f5e744e0498dbb496d |
| publicationDate | 2019-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2019208461-A1 |
| titleOfInvention | Etching liquid for copper foils, method for producing printed wiring board using said etching liquid for copper foils, etching liquid for electrolytic copper layers, and method for producing copper pillar said etching liquid for electrolytic copper layers |
| abstract | The present invention relates to: an etching liquid for copper foils, which is capable of etching a copper foil, while suppressing the occurrence of side etching of a copper wiring line; and a method for etching a copper foil and a method for producing a printed wiring board, each of which uses this etching liquid for copper foils. The present invention also relates to: an etching liquid for electrolytic copper layers, which is capable of etching an electrolytic copper layer, while suppressing the occurrence of side etching of the electrolytic copper layer; and a method for etching an electrolytic copper layer and a method for producing a copper pillar, each of which uses this etching liquid for electrolytic copper layers. An etching liquid according to the present invention is characterized by containing (A) hydrogen peroxide, (B) sulfuric acid and (C) at least one azole compound that is selected from the group consisting of 5-amino-1H-tetrazole, 1, 5-pentamethylenetetrazole and 2-n-undecylimidazole. This etching liquid is also characterized in that: the molar ratio of the hydrogen peroxide (A) to the sulfuric acid (B) is within the range of 6-30; the concentration of the azole compound (C) is within the range of 0.001-0.01% by mass; and phosphoric acid is not substantially contained therein. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023163003-A1 |
| priorityDate | 2018-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.