| abstract |
Disclosed are: an etching solution for a multilayer thin film having a copper layer and a molybdenum layer contained therein; and a method for etching a multilayer thin film having a copper layer and a molybdenum layer contained therein using the etching solution.nSpecifically disclosed are: an etching solution for a multilayer thin film having a copper layer and a molybdenum layer contained therein, which comprises (A) hydrogen peroxide, (B) an inorganic acid having no fluorine atom, (C) an organic acid, (D) an amine compound having 2 to 10 carbon atoms and also having an amino group and a hydroxy group in the total number of two or more, (E) an azole, and (F) a hydrogen peroxide stabilizer, and which has a pH value of 2.5 to 5; and an etching method using the etching solution. |