| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3475
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-44 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate |
2019-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0502195b3ce551cb9a304476824d2570
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14a279f01565268df89d7782f63ffeff |
| publicationDate |
2020-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I708997-B |
| titleOfInvention |
Photosensitive resin composition, method for forming photoresist pattern, and method for manufacturing circuit board |
| abstract |
The present invention provides a photosensitive resin composition suitable for heating after exposure to achieve higher resolution. The photosensitive resin composition of the present invention is used for heating after exposure, followed by development to obtain a cured resin, and the photosensitive resin composition contains the following components based on the mass of all solid components of the photosensitive resin composition: (A) Alkali-soluble polymer: 10% by mass to 90% by mass; (B) Compounds with ethylenically unsaturated double bonds: 5% by mass to 70% by mass; and (C) Photopolymerization initiator: 0.01% by mass to 20% by mass %; And (A) The structural unit of styrene and/or styrene derivative in the whole alkali-soluble polymer is 15% by mass or more. |
| priorityDate |
2018-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |