| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0082 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0007 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F1-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate |
1999-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2005-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100470467-B1 |
| titleOfInvention |
Method of forming conductive pattern |
| abstract |
The present invention provides a process for (1) laminating a conductive film-forming resin layer and an energy beam-sensitive coating layer on a substrate in this order, and (2) an active energy beam or hot wire on the surface of the energy beam-sensitive coating layer so as to obtain a desired pattern. (3) developing the energy beam-sensitive film layer and forming a resist pattern film by the energy beam-sensitive film layer, and (4) forming an exposed conductive film. Provided is a conductive pattern forming method comprising the step of removing the resin layer for development by a developing treatment.nn n n Moreover, this invention performs the said (1) process, (2) process, (3 '), and then includes the process of simultaneously removing the energy beam-sensitive film layer and the resin layer for conductive film formation by a development process. A conductive pattern forming method is also provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102107871-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150118959-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100996316-B1 |
| priorityDate |
1998-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |