http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105338735-B
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-05 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 |
filingDate | 2015-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2017-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2017-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-105338735-B |
titleOfInvention | A kind of mixing material printed wiring board new producing method |
abstract | The present invention discloses a kind of mixing material printed wiring board new producing method, including step:Material preparation, the making of aluminium base copper bar hard board, the making of mixing material flitch, the making of copper face circuit, lift-off processing, finished product make, examine shipment.In aluminium base copper bar hard board making step; protected using the pressing of copper foil and aluminium base; prepreg can effectively be prevented when mixing material flitch makes because pressing is flow on finished product exposed aluminium face; and copper foil, dielectric layer, copper bar above exposed aluminium face is needed to carry out lift-off processing product by laser formation mode; expose aluminium face, can effectively avoid the mechanical scratch to aluminium base. |
priorityDate | 2015-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.