http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101328887-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 |
| filingDate | 2009-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101328887-B1 |
| titleOfInvention | Photosensitive resin composition, photosensitive resin laminated body, resist pattern formation method, and conductor pattern, printed wiring board, lead frame, base material, and manufacturing method of semiconductor package |
| abstract | Provided is a photosensitive resin composition that provides excellent resolution, adhesiveness, tentability, and peelability. The present invention is (a) a thermoplastic polymer having an acid equivalent of 100 to 600 and a weight average molecular weight of 5,000 to 500,000 polymerized using at least an α, β-unsaturated carboxyl group-containing monomer as a polymerization component, and (b) at least one polymerizable molecule. An addition polymerizable monomer having an ethylenically unsaturated bond, (c) a photopolymerization initiator, and (d) the following general formula (I): (Wherein, R 1 to R 5 are each independently H, an aryl group or an arylalkyl group, and at least one of R 1 to R 5 is an aryl group or an arylalkyl group, and A 1 is C 2 H 4 or C 3 It is H < 6> , and when n < 1> is 2 or more, some A < 1> may mutually be same or different, and n < 1> is an integer of 1-50), The photosensitive resin composition containing the compound shown is provided. |
| priorityDate | 2008-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 251.