| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0669
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F2203-04103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F2203-04102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823871
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S977-89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F2203-04107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S977-762
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S977-956
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-133302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1377
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y40-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13338 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041 |
| filingDate |
2014-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2019-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-105593796-B |
| titleOfInvention |
Protective coatings for printed conductive patterns on patterned nanowire transparent conductors |
| abstract |
A method for making an electronic assembly is disclosed, the method comprising applying a protective layer comprising an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit covers at least a portion of the conductive layer on a substrate and wherein the conductive layer includes nanowires; and bonding electrical contacts of the electronic component with the protective layer to electrically connect the electronic component with the patterned conductive layer. |
| priorityDate |
2013-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |