| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0597
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-02 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-34 |
| filingDate |
2005-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100828979-B1 |
| titleOfInvention |
Etch solution, etching method and printed wiring board |
| abstract |
The etching solution which added the high concentration triazole type compound which can form the film which has an etching inhibitory effect in the cupric chloride solution is proposed. In the process of circuit pattern formation by the etching process using this etching liquid, since an etching suppression film is selectively formed in a part of copper foil located below the edge of an etching resist, side etching of copper foil in the horizontal direction is performed from the edge of an etching resist. It can be effectively suppressed. Moreover, since nonuniform fine unevenness | corrugation is formed in the side wall of the circuit pattern formed by the etching process, adhesiveness with the resin insulating layer which coat | covers a circuit pattern improves.n n n n Etching solution, etching suppression coating, printed wiring board |
| priorityDate |
2004-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |