abstract |
The present invention provides a microetching agent and a replenishing liquid thereof, and a method of manufacturing a wiring substrate using a microetching agent. The microetching agent of the present invention is formed from an aqueous solution containing a copper ion, an organic acid, a halide ion, a compound containing an amino group having a molecular weight of 17 to 400, and a polymer. The polymer is a water-soluble polymer having a polyamine chain and/or a cationic group and having a weight average molecular weight of 1,000 or more. In the microetching agent of the present invention, when the concentration of the compound containing an amine group is A% by weight and the concentration of the polymer is B% by weight, the value of A/B is 50 to 6,000. According to the present invention, the adhesion between copper and resin can be maintained even with a low etching amount. |