http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201404937-A

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filingDate 2013-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99ed4a89e54ad61844e97cf84e3f1f97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_725b00f257c2761e9cd849016367c53f
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publicationDate 2014-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201404937-A
titleOfInvention Copper micro etching liquid and its replenishing liquid, and manufacturing method of wiring substrate
abstract The present invention provides a microetching agent and a replenishing liquid thereof, and a method of manufacturing a wiring substrate using a microetching agent. The microetching agent of the present invention is formed from an aqueous solution containing a copper ion, an organic acid, a halide ion, a compound containing an amino group having a molecular weight of 17 to 400, and a polymer. The polymer is a water-soluble polymer having a polyamine chain and/or a cationic group and having a weight average molecular weight of 1,000 or more. In the microetching agent of the present invention, when the concentration of the compound containing an amine group is A% by weight and the concentration of the polymer is B% by weight, the value of A/B is 50 to 6,000. According to the present invention, the adhesion between copper and resin can be maintained even with a low etching amount.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I627886-B
priorityDate 2012-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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