| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate |
2017-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9928cf70d21326903f023bd85bce9d4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adf4e3b8970ed1410e1c5ac35ad30e8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cde6e9ca82e87e83de8a19b85c7de86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28bf8b6ca0c0e1d07642332d55ce4826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69363800363498c3d3d56cd4a3939405 |
| publicationDate |
2019-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019148169-A1 |
| titleOfInvention |
Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate |
| abstract |
A method for manufacturing a package substrate for mounting a semiconductor device, including a substrate forming step (a) of forming a supporting substrate for circuit formation including a first insulating resin layer, a release layer including at least a silicon compound, and ultrathin copper foil having a thickness of 1 μm to 5 μm, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11545455-B2 |
| priorityDate |
2016-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |