| abstract |
The present invention is a method for manufacturing circuit device that uses ceramic substrate or flexible board as the support substrate for the installation of circuit components and can ensure high productivity even when miniaturization and thinness of the circuit device are required. After forming conductive patterns (51) of each individual block (62), circuit components are installed, insulating resin (50) is applied for molding, and etching process is carried out to etch the conductive patterns (51) on the back of a conductive foil (60). Since test procedure and cutting procedure are carried out at the same time after several blocks are attached onto an adhesive plate, the method for manufacturing circuit device can enforce significant resource saving and is suitable for mass production. |