abstract |
The present invention is an insulating resin composition layer 121 formed by forming one or two or more layers, and a connecting conductor 13 formed so as to penetrate the insulating resin composition layer in a thickness direction at least at a portion connecting the conductor circuit 103. The present invention provides a connecting substrate 11, a multilayer wiring board, a semiconductor package substrate and a semiconductor package using the connecting substrate, and a method of manufacturing the same. |