| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4903b7b4b84e3b845aef791cad8f2e97 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-141
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P40-57
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2218-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10378 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C23-0025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-352
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C17-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-352
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C15-00 |
| filingDate |
2020-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6da49500221f1e9dffdd71951c333a2c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8b63a341f5a7886043cab0ca2c9e32a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45a5b1ab03a89a9c4173edb2316ce74c |
| publicationDate |
2020-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020303188-A1 |
| titleOfInvention |
Glass substrate with through glass vias |
| abstract |
A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate. |
| priorityDate |
2014-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |