Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0344 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
filingDate |
2019-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2023-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2023-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-7215478-B2 |
titleOfInvention |
Substrate for printed wiring board, method for producing substrate for printed wiring board, and printed wiring board |
priorityDate |
2018-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |