http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016136595-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19b5c6093f8859d3e6bf9237df2eb5b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2015-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11bfd2aba9b4bb9c48b6592d093f2721 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_250617a83f8c061522f10ca1830f4541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4af837243762f4f43ea4a14139b600ea http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b296623b77e7b25986e83c52436179bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffc744329ed2b7dd44f85526949df6d8 |
| publicationDate | 2016-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016136595-A |
| titleOfInvention | Printed wiring board manufacturing method, printed wiring board substrate, and printed wiring board |
| abstract | Provided are a printed wiring board substrate manufacturing method, a printed wiring board substrate, and a printed wiring board, which can reduce the conductive pattern defects and can reduce the defects of the conductive pattern. With the goal. A printed wiring board substrate manufacturing method according to an aspect of the present invention includes a step of applying an ink containing metal particles to at least one surface of an insulating base film, and the application described above. A step of firing the ink, the elapsed time after the production of the ink is within one month, and a convex portion having an average diameter of 10 μm or more and a maximum height of 5 μm or more on the outer surface of the sintered layer formed by the firing step. The generation rate is controlled to 1 piece / cm 2 or less. The content of metal particles in the ink is preferably 5% by mass or more and 50% by mass or less. It is preferable to further include a step of performing electroless plating on the outer surface of the sintered layer. It is preferable to further include a step of electroplating the outer surface side of the sintered layer. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7215478-B2 |
| priorityDate | 2015-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.