| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_943ce8b5eab241d0469c8cbcbcd3dbce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0141
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2016-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d27909dc6edd5fa6343aac02e9e2c0b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c5aa5105a40398af6f42d12d1180dcc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3f58d225f9fb8adad4731e17b51092f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_163125501e50e36574e8c0553298cc3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b28d9e66bd3a8e6daa7ef9d6cb354fd1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_886142ea8e6ccd62cdd32fe51c13b398 |
| publicationDate |
2016-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2016117575-A1 |
| titleOfInvention |
Substrate for printed wiring board, printed wiring board, and method for manufacturing printed wiring board |
| abstract |
The purpose of the present invention is to provide a substrate for a printed wiring board that has great peel strength between a base film and a metal layer, and that can be manufactured inexpensively. A substrate for a printed wiring board according to an embodiment of the present invention is provided with a base film exhibiting insulation properties and a sintered layer of a plurality of metal particles laminated on at least one surface of the base film, wherein the porosity of the sintered layer in a region of up to 500 nm from the interface with the base film is 1-50%. A method for manufacturing a substrate for a printed wiring board according to another embodiment of the present invention is provided with a step for applying an ink containing metal particles on one surface of a base film exhibiting insulation properties, and a step for sintering an ink coating formed by the application step. In the sintering step or a step thereafter, the porosity of a sintered layer, which is formed by sintering the coating, in a region of up to 500 nm from the interface with the base film is adjusted so as to be 1-50%. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020245458-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7215478-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019075457-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019077815-A1 |
| priorityDate |
2015-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |