http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
Outgoing Links
| Predicate | Object |
|---|---|
| concordantIPC | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| level | 10^^<http://www.w3.org/2001/XMLSchema#integer> |
| symbol | H05K3/188 |
| modified | 2013-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| title | Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating |
| type | http://data.epo.org/linked-data/def/cpc/SubGroup |
| broader | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 |
Incoming Links
Total number of triples: 1884.