| abstract |
It is an object of the present invention to provide a laminate, such as a conductive pattern, which has excellent adhesion to the junction between a layer serving as a pad and a conductive layer containing a conductive material, and the conductive layer and a cladding layer. The present invention provides a laminate comprising at least a support layer (I), a conductive layer (II) having an oxidized surface, and a plating layer (III) formed on the oxidized surface of the conductive layer (II); the present invention also provides a conductive pattern and circuit, both of which include such laminate. |