| abstract |
The present invention provides a method for forming a metal film including: (a1) a step of providing, on a substrate, a polymer layer that includes a polymer containing a functional group that interacts with a metal ion or a metal salt, the polymer directly chemically bonding to the substrate; (a2) a step of applying a metal ion or a metal salt to the polymer layer; (a3) a step of reducing the metal ion or the metal salt to form a conductive layer having a surface resistivity of from 10 to 100 kΩ/square; and (a4) a step of forming a conductive layer having a surface resistivity of 1×10 −1 Ω/square or less by electroplating. |