| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-4833 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48 |
| filingDate |
2018-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b4094129d675b67b9f93bb125edc88c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbf3c6a8cd61483d27e5df8a06699773 |
| publicationDate |
2018-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2018119211-A |
| titleOfInvention |
Method for manufacturing printed circuit board |
| abstract |
Provided is a method for manufacturing a printed circuit board in which a first gold plating layer can be easily formed on a stainless steel terminal with simple equipment. A method of manufacturing a suspension board with circuit includes a first step of preparing a stainless support layer having a passive film formed on the surface, and a first gold plating layer on a surface of a stainless terminal. The second step 2 is formed. In the second step 2, the stainless steel support layer 22 is immersed in a first gold plating solution that does not contain a strong acid but contains a weak acid and a gold compound, and the passive film 25 is removed while the first gold plating layer 31 is removed. Power is supplied to the stainless steel support layer 22 so as to be formed on the surface of the stainless steel terminal 26. [Selection] Figure 1 |
| priorityDate |
2017-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |