| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8321a4d88d3c45cbb4a9ebf4e9c07ec4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-33396 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-333
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2021-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d2f52d4a78b8b42915b19543b644117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f58947fd91793e96fa948b2acea33ca8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45cc755a00059f7340606f7dc29039d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6fe0743d04c7300c750b9b150bae118 |
| publicationDate |
2021-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2021310141-A1 |
| titleOfInvention |
Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics |
| abstract |
An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic compostion. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P: |
| priorityDate |
2016-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |