| abstract |
In the field of electroplating printed circuit boards (PCBs), a leveling agent in an electroplating bath is important in order to obtain a uniform metal deposit on a substrate surface. PROBLEM TO BE SOLVED: To provide a compound useful as a leveling agent for use in a metal electroplating bath for PCB production, and a composition for an electroplating bath containing the compound, which is capable of smooth copper deposit while strengthening. One or more heterocyclic nitrogen compounds containing at least two reactive nitrogen atoms, provided that at least one of the reactive nitrogen atoms is in the ring of the one or more heterocyclic nitrogen compounds. Compound containing reaction product of one or more kinds of heterocyclic nitrogen compounds, one or more kinds of polyepoxide compounds and one or more kinds of polyhalogen compounds, and composition for electroplating bath containing the compounds . The heterocyclic nitrogen compound is preferably pyrroles, pyridines, imidazoles, triazoles, triazines and the like. [Selection figure] None |