Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
filingDate |
1999-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fdf557d523172a0a0010fb8c83a865c9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81a27bbc339432be8db17e4d40e3eeea http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e88564db9c7ef616409766aad8882c1 |
publicationDate |
2000-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2000226431-A |
titleOfInvention |
Epoxy resin composition, epoxy resin laminate, metal-clad epoxy resin laminate, and printed wiring board |
abstract |
(57) [Problem] To provide an epoxy resin composition having a high Tg, low dielectric properties, good adhesion of metal foil, and a cured product having good solder heat resistance. . SOLUTION: An essential component is (a) an epoxy resin obtained by epoxidizing a condensate of a phenol and a hydroxybenzaldehyde, (b) a phenol-added polybutadiene and (c) a compound having a triazine ring. Epoxy resin composition. This epoxy resin composition is used to form an epoxy resin laminate or a metal-clad epoxy resin laminate, and a printed wiring board. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000239640-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015227327-A |
priorityDate |
1999-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |