| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cb116c57788ac6296b7a8981f13e86e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0789
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-188
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
2016-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db5701b785410098b30826067d217050 |
| publicationDate |
2017-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201728786-A |
| titleOfInvention |
Acid copper plating solution, acid copper plating material, and manufacturing method of semiconductor device |
| abstract |
The acid copper plating solution of the present invention comprises: a first additive comprising a cationic polymer; and a second additive selected from the group consisting of 2-mercapto-5-benzimidazolesulfonic acid and 2-mercapto-5-benzimidazolesulfonate At least one of a group consisting of sodium dihydrate, ethylthiourea, and a portion of 2-mercapto-5-benzimidazolesulfonate of poly(diallyldimethylammonium chloride); and 3 additive comprising an organic compound containing a sulfur atom; and having a copper concentration of 10 to 60 g/L, a sulfuric acid concentration of 10 to 200 g/L, and containing less than 90 mg/L of chloride ions, and capable of producing low thermal expansion Acidic copper plating. |
| priorityDate |
2015-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |