http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
Outgoing Links
| Predicate | Object |
|---|---|
| concordantIPC | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| level | 11^^<http://www.w3.org/2001/XMLSchema#integer> |
| symbol | H05K3/427 |
| modified | 2013-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| title | Plated through-holes characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates |
| type | http://data.epo.org/linked-data/def/cpc/SubGroup |
| broader | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-425 |
Incoming Links
Total number of triples: 2218.