http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9014225-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1394 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 1990-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e5f98af8f2773c12091bb9f435a5f4d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0304135218ca5c1beb94c6b52698fd0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d4a3fd8f16c7eda62bcd569cd338278 |
| publicationDate | 1990-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-9014225-A1 |
| titleOfInvention | Photo-curable resin laminate and method of producing printed wiring board using the same |
| abstract | A photo-curable resin laminate composed of a support and a photo-curable resin layer disposed on one of the surfaces of the support, wherein the photo-curable resin layer has: (a) a viscosity of 10?4 to 5 x 10?5 P at 90C, (b) a thickness of 30 to 150 $g(m)m, and (c) an UV transmissivity of 40 to 95 % at a wavelength of 365 nm. This photo-curable resin layer is laminated under pressure on both surfaces of a metal-coated insulating plate having small through-holes having a 0.5 mm or smaller inner diameter in such a manner that the side of the photo-curable resin layer comes into contact with both surfaces of the metal-coated insulating plate, the photo-curable resin layer enters partially inside the inner peripheral edge of the open portion of each through-hole so as to define a photo-curable resin layer extending from this edge along the inner wall of the through-hole in a predetermined depth on the inner wall surface. The curable resin layer which is in close contact from the inner peripheral edge of the opening of the through-hole to the inner wall is formed by exposure and development to give the coating of the opening of the through-hole free from any coating defect. When an unnecessary conductor layer other than the conductor layer of a desired pattern is thereafter removed with an etchant, a printed wiring board having the small diameter through-holes and extremely high reliability of conduction between both surfaces by the through-holes can be produced. |
| priorityDate | 1989-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 103.