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filingDate 2000-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03faebb4baeb872c6dc9939da38a9363
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publicationDate 2009-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2086299-A1
titleOfInvention Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
abstract A multi-layer printed circuit board comprising: a core substrate having through holes for connecting the upper and lower surfaces to each other and having a structure that interlayer resin insulating layers and conductor circuits are alternately laminated on said core substrate, wherein nthrough holes having different diameters are formed in said core substrate.
priorityDate 1999-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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