| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate |
1997-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2000-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000503259-A |
| titleOfInvention |
Multi-Frequency Processing to Minimize Manufacturing Variation in Micro-Through Via with High Aspect Ratio |
| abstract |
(57) Abstract: Laser drilling through-vias in a laminated substrate from a top exposed surface of a substrate to a bottom exposed surface of the substrate using a plurality of laser pulses trepanned in a first predetermined pattern. Method for forming through vias in a laminated substrate. Each pulse trepanned in the first predetermined pattern has an energy density per first pulse. Next, the through-via is laser drilled using a plurality of laser pulses trepanned in a second predetermined pattern. Each pulse trepanned in the second predetermined pattern has an energy density per second pulse greater than the energy density per first pulse. The second predetermined pattern is within the first predetermined pattern. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014515176-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101567384-B1 |
| priorityDate |
1996-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |