| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7e752c7f109e512673e3ab834ee5ff28 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0344
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09854
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-186
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate |
2020-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6a27aa8e5fb8aeae953f09a33a3234e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2a658987dbceb1a6a8d4917167f4422 |
| publicationDate |
2020-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-M600477-U |
| titleOfInvention |
Component carrier with through hole filled with extra plating structure between sidewalls and plated bridge structure |
| abstract |
A component carrier (100) is provided. The component carrier includes: an electrically insulating layer structure (102) having a first main surface (104) and a second main surface (106); a through hole (108) extending through the electrically insulating layer structure (102) Located between the first main surface (104) and the second main surface (106), and has a first tapered portion (114) extending from the first main surface (104) and a second main surface (106) The second tapered portion (116); the first plating structure (180), the first plating structure is located on at least a portion of the sidewall (112) of the electrically insulating layer structure (102), the sidewall (112) defines a through hole (108); and a second plating structure (182), which is formed separately from the first plating structure (180) and arranged on the first plating structure, wherein the second plating structure ( 182) includes a conductive bridge structure (110) connecting opposite sidewalls (112). |
| priorityDate |
2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |