http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101528444-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0671 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 2013-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101528444-B1 |
| titleOfInvention | Laminate and method for manufacturing printed circuit board |
| abstract | A laminate for use in an element mounting board obtained by forming a conductor circuit by etching a copper foil having an insulating layer and a copper foil located on at least one side of the insulating layer and comprising 55.9 g / L of sulfuric acid and 19.6 cc of 34.5% hydrogen peroxide / L and an etching rate of 0.68 탆 / min or more and 1.25 탆 / min or less under the condition of immersing the laminate in an etching solution of sulfuric acid / hydrogen peroxide system having a liquid temperature of 30 ° C ± 1 ° C. |
| priorityDate | 2012-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 157.