http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0233201-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f75c33ae35e5d1dc4b05e62ec461c17f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09736 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-243 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3473 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-427 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate | 1986-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_603e0a235113fb1d62970bb5dc0c277e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6b6b64aebed791b8e67640d6ec0100a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb1daf3243f9dda767a84f97f66fe08c |
| publicationDate | 1987-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0233201-A1 |
| titleOfInvention | Method for manufacture of printed circuit boards |
| abstract | Printed circuit boards having solder-coated pads and through holes (140) and bare copper traces (160), protected by a solder mask (260) which is applied directly or by a layer of metal not in front remelt, and by a solder mask placed on top. The cards are produced by a process which avoids the need to remove the tin / lead layer and eliminates the need for separate application of molten solder and its equalization. In the preferred method, liquid reserves (240) are applied to circuit boards having holes (140) plated with copper with the addition of tin / lead on top, and pads to define and protect against attack traces copper (160) of a circuit having the desired configuration or other configurations. Copper zones other than those protected by the reserve (240) and the tin / lead plating (220) are removed by attack. The reserve (240) is then removed and the solder mask (260) is applied to the traces of bare copper (160) or to other areas of bare copper, or else applied to bare copper previously coated with a metal that do not recast. The tin / lead plating (220) is then preferably remelted and solidified to fill the pellets and the through holes with a layer of solder. |
| priorityDate | 1985-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.