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filingDate 2004-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20060009885-A
titleOfInvention Double-sided wiring board, manufacturing method of double-sided wiring board and multilayer wiring board
abstract Only one layer of wiring layers 191 and 192 are provided on the roughened substrate surface 110S on both surfaces of the core substrate 110 by the semi-additive method, respectively. Wiring of the wiring layers on both sides of the core substrate is electrically connected through the through holes 180 arranged in the core substrate. The through hole is made up of a through hole formed by a laser in the core substrate, and the inside of the through hole is filled with a plated conductive portion 193. In a state where the predetermined end portion 170 is exposed, both surfaces of the core substrate are covered by the solder resist 160. The outer surface of the through hole and the outer surface of the wiring portion of the wiring layer are planarized by mechanical polishing, chemical mechanical polishing, or the like.
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priorityDate 2003-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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